Transforming Thermal Modelling of Electronic Components for Space Systems

Electronic components play a vital role in space systems, enabling a wide range of functions, from data processing to power management. To ensure optimal performance and prevent overheating, thermal engineers receive a CAD file containing the mechanical design, including PCBs and the chassis, from electronic engineers. This serves as the baseline for the thermal design process, where advanced thermal modelling techniques are employed.

Maximizing Efficiency through Precision Thermal Modelling

The core objective of thermal modelling is to ensure that electronic components remain within their operational temperature limits, even when the unit's temperature reference point (TRP) reaches its operating limits. By considering the unit environment, including electronic components, PCBs, chassis, and satellite interfaces, thermal engineers meticulously construct a comprehensive thermal model.

Working Principles : Unveiling the Power of Advanced Thermal Modelling

PCBs consist of multiple layers of copper and dielectric materials. To accurately model the thermal behavior of PCBs, the thicknesses of copper and dielectric layers are separately summed and represented as two distinct layers. Conduction within the PCB is calculated in the thickness, between the layers, and across the plane. Electronic components are represented as thermal nodes, with one node corresponding to the component's case and another to the junction between the component and the PCB. The dissipation power is applied to the junction face.

Thermal conductance connects the case and junction thermal nodes, while the junction thermal node is linked to the PCB thermal nodes through thermal resistance. In the absence of early-stage information about the thermal resistance between the junction and the board, a contact conductance value of 2000 w/Km2 is assumed. Radiation is typically neglected due to its minimal contribution compared to conduction.

To optimize thermal design, thermal pads are often used between electronic component cases and the chassis, creating a conductive link and facilitating heat dissipation. Additionally, thermal straps or heat pipes are directly connected to the PCBs and chassis, further enhancing heat transfer. The inclusion of heaters, alongside controlling the satellite interface, allows for adjustable power output, effectively managing thermal conditions.

Results: Benefits and Considerations

Benefits: A Well-Established Approach

Limitations: Addressing Time Consumption

Importance : Revolutionizing Space Thermal Engineering

The complete digitalization and automation of the thermal modelling process for electronic components have the potential to revolutionize space thermal engineering. By embracing this cutting-edge approach, efficiency can be significantly improved, leading to enhanced system performance and reduced risks.

Pioneering the Future of Space Thermal Engineering

As technology continues to advance, the integration of digitalization and automation into thermal modelling processes becomes crucial. By making this transformative approach accessible to the wider space thermal engineering community, we can unlock new levels of efficiency and propel our exploration of the cosmos to unprecedented heights.

Are you seeking expert guidance and support for your thermal engineering needs?

Look no further. Our team of experienced professionals specializes in advanced thermal modelling and offers comprehensive consultancy services tailored to your specific requirements. Whether you're working on space systems or any other electronic component application, we are here to assist you in optimizing thermal performance, improving efficiency, and ensuring the longevity of your devices. Contact us today to explore how our cutting-edge solutions can elevate your thermal engineering endeavors:  contact us